| 摘要 |
PURPOSE: A module bonding method for flat panel display and an apparatus are provided to bond an anisotropic conductive film and modules without an additional unloading process and to improve work efficiency. CONSTITUTION: A substrate is mounted on a substrate mounting portion. A plasma processing unit(6) irradiates plasma on a module bonding surface. A film bonding unit(7-1) adheres an anisotropic conductive film to the substrate. A pre-bonding unit(7-2) performs the preliminary bonding of all kinds of the modules. A main bonding unit(7-3) performs the main bonding of the modules. An inspection unit(8) inspects the module bonding. An unloading unit(9) separates the substrate from the substrate mounting portion. [Reference numerals] (A1,A2,A3,A4,A5,A6) Main bonding step; (BB) Inspection step; (CC) Unloading step; (DD) Loading step; (EE) Plasma processing step; (FF) Film bonding step; (GG) Preparatory bonding step |
