High performance electronics system with a cooling device

摘要

The system has a set of submodules (16), a flat insulating material body (160) and a power switch arranged on a conductor path (162). An internal connection device has an electrically-conducting foil and an electrically-insulating foil. An electrically-conducting layer has another conductor path and connection elements. The submodules are arranged in a cooling device (14) in a firmly-bonded or force-fit manner. The latter conductor path partially covers the former conductor path and covers an intermediate area between the submodules, where the paths are electrically connected with one another. An independent claim is also included for a method for manufacturing a power electronic system.