发明名称 Mainframe structure
摘要 A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.
申请公布号 US8351194(B2) 申请公布日期 2013.01.08
申请号 US20100981148 申请日期 2010.12.29
申请人 DATAVAN INTERNATIONAL CORP.;KU KANG;LIU HSIEN-TANG;LIU WEN-CHENG 发明人 KU KANG;LIU HSIEN-TANG;LIU WEN-CHENG
分类号 H05K5/00;F28F7/00;H05K7/20 主分类号 H05K5/00
代理机构 代理人
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