发明名称 |
Semiconductor surface protecting method |
摘要 |
Provided are a semiconductor surface protecting method and surface protecting sheet employing a material having adequate conformability for irregularities on semiconductor wafer circuit sides and sufficient rigidity as a support during grinding, and which does not become fluid with repeated temperature increases. Also provided is a surface protecting sheet for protection of the circuit side in the step of back side grinding of a semiconductor wafer, the surface protecting sheet having a polymeric film material with a surface protecting layer thereon that may become fluid upon heating and which hardens upon exposure to radiation or upon heating.
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申请公布号 |
US8349706(B2) |
申请公布日期 |
2013.01.08 |
申请号 |
US20040595678 |
申请日期 |
2004.10.15 |
申请人 |
3M INNOVTIVE PROPERTIES COMPANY;NODA KAZUKI |
发明人 |
NODA KAZUKI |
分类号 |
H01L21/30;B24B7/22;B24B37/30;B24B55/00;C09J7/02;H01L21/00;H01L21/304;H01L21/68 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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