发明名称 |
Flipchip bump patterns for efficient I-mesh power distribution schemes |
摘要 |
Disclosed is a flipchip scheme where power and ground bumps are arranged in a striped configuration. Specifically, there are a plurality of lines of power bumps, and a plurality of lines of ground bumps. Each line of power bumps is interconnected by a mesh core power bus, and each line of ground bumps is interconnected by a mesh core ground bus. The busses are shorted across the bumps without having to use metal tab extensions. This arrangement provides that: signal routing can be provided between the lines of bumps; and/or the mesh core power busses can be provided as being wider in order to provide improved power mesh performance and/or in order to reduce or eliminate the metal required on the second top-most metal layer.
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申请公布号 |
US8350375(B2) |
申请公布日期 |
2013.01.08 |
申请号 |
US20080121363 |
申请日期 |
2008.05.15 |
申请人 |
LSI LOGIC CORPORATION;ALI ANWAR;DODDAPANENI KALYAN;LEUNG WILSON |
发明人 |
ALI ANWAR;DODDAPANENI KALYAN;LEUNG WILSON |
分类号 |
H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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