发明名称 |
Semiconductor device and information processing system including the same |
摘要 |
A semiconductor device includes a plurality of core chips and an interface chip that controls the core chips. Each of the core chips and the interface chip includes plural through silicon vias that penetrate a semiconductor substrate and plural pads respectively connected to the through silicon vias. The through silicon vias include a through silicon via of a power source system to which a power source potential or a ground potential is supplied, and a through silicon via of a signal system to which various signals are supplied. Among the pads, at least an size of a pad connected to the through silicon via of the power source system is larger than a size of a pad connected to the through silicon via of the signal system. Therefore, a larger parasitic capacitance can be secured.
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申请公布号 |
US8350389(B2) |
申请公布日期 |
2013.01.08 |
申请号 |
US20100923789 |
申请日期 |
2010.10.07 |
申请人 |
ELPIDA MEMORY, INC.;ITAYA SATOSHI;SHIBATA KAYOKO;AZUMA SHOJI;IDE AKIRA |
发明人 |
ITAYA SATOSHI;SHIBATA KAYOKO;AZUMA SHOJI;IDE AKIRA |
分类号 |
H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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