发明名称 Light emitting element
摘要 A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
申请公布号 US8350287(B2) 申请公布日期 2013.01.08
申请号 US201113187090 申请日期 2011.07.20
申请人 SEOUL SEMICONDUCTOR CO., LTD.;SEO TAE WON;ALEXANDER ZHBANOV;KIM DAE WON 发明人 SEO TAE WON;ALEXANDER ZHBANOV;KIM DAE WON
分类号 H01L33/00 主分类号 H01L33/00
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