发明名称 |
Integrated circuits on a wafer and methods for manufacturing integrated circuits |
摘要 |
Integrated circuits (1) on a wafer comprise a wafer substrate (2), a plurality of integrated circuits (1) formed lattice-like in rows and columns on the wafer substrate (2), and first and second saw lines (4, 5) separating the integrated circuits (1). The first saw lines (4) run parallel and equidistant with respect to each other in a first direction (x) defined by the rows and the second saw lines (5) run parallel and equidistant with respect to each other in a second direction (y)defined by the columns. The integrated circuits (1) on the wafer further comprise a plurality of process control modules (3) formed on the wafer substrate (2) such that a given process control module (3) of the plurality of process modules (3) is bounded by two consecutive first saw lines (4) as well as by two consecutive second saw lines (5).
|
申请公布号 |
US8349708(B2) |
申请公布日期 |
2013.01.08 |
申请号 |
US20080668418 |
申请日期 |
2008.07.10 |
申请人 |
NXP B.V.;SCHEUCHER HEIMO;DORMANS GUIDO;KAMPHUIS TONNY |
发明人 |
SCHEUCHER HEIMO;DORMANS GUIDO;KAMPHUIS TONNY |
分类号 |
H01L21/46;H01L21/301;H01L21/78 |
主分类号 |
H01L21/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|