发明名称 Semiconductor device structure with strain layer
摘要 A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect.
申请公布号 US8350354(B2) 申请公布日期 2013.01.08
申请号 US20100951808 申请日期 2010.11.22
申请人 SAMSUNG ELECTRONICS CO., LTD.;LEE SEUNG-HWAN;SHIN HEON-JONG;MAEDA SHIGENOBU;WI SUNG-REY;QUAN WANGXIAO;CHOI HYUN-MIN 发明人 LEE SEUNG-HWAN;SHIN HEON-JONG;MAEDA SHIGENOBU;WI SUNG-REY;QUAN WANGXIAO;CHOI HYUN-MIN
分类号 H01L21/70;H01L21/762 主分类号 H01L21/70
代理机构 代理人
主权项
地址