| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an interposer that can suppress electromagnetic interference in a semiconductor package and electromagnetic interference between the semiconductor package and a component or circuit in the vicinity of the semiconductor package by absorbing electromagnetic noise inside the semiconductor package. <P>SOLUTION: An interposer is configured to mount a semiconductor element having an electrode terminal, and has a mounting terminal on a lower surface of the interposer. The interposer includes a wiring board with wirings 7 comprised of a signal line, power source line or ground line to establish connection between the electrode terminal and the mounting terminal. A ferrite film 8 formed by electroless plating is disposed on the wirings 7 along the wirings 7. The ferrite film 8 is a film having a film thickness of 1-20 μm containing at least one of a Ni-Zn-based ferrite or Mn-Zn-based ferrite. The ferrite film and the wirings are disposed at an interval of 0-50 μm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
