| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing unit which, while taking correlations with processing time (throughput) and other factors into consideration, controls the movement speed of a liquid nozzle more easily and suitably than ever, making it possible to evenly clean and dry the entire surface of the substrate. <P>SOLUTION: In a substrate processing method, liquid is ejected from a liquid nozzle to a rotating substrate surface, and the liquid nozzle is moved from the center part of the rotating substrate to the outer periphery thereof while the surface is being processed. More specifically, the liquid nozzle is moved at a constant initial movement speed from the center of the substrate till a displacement point and, past the displacement point, it is moved at a movement speed V<SB POS="POST">(r)</SB>at which the liquid nozzle passes a position corresponding to a distance r from the center of the substrate and which satisfies the relationship V<SB POS="POST">(r)</SB>×r<SP POS="POST">α</SP>=constant, where α is an exponent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
