发明名称 METAL-CLAD LAMINATED PLATE AND PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a metal-clad laminated plate with which higher transmission speed can be achieved and a highly reliable substrate can be manufactured. <P>SOLUTION: The metal-clad laminated plate 11 is used including an insulation layer 12, and a metal layer 13 located at least on one surface side of the insulation layer 12, wherein the insulation layer 12 is formed by laminating at least two layers which are a first resin layer 14 and a second resin layer 15 located between the first resin layer 14 and the metal layer 13, the first resin layer 14 and the second resin layer 15 contain hardened materials of resin compositions, respectively, the resin composition of the first resin layer 14 is different from the resin composition of the second resin layer 15, and the relative permittivity of the hardened material of the resin composition contained in the second layer 15 is lower than the relative permittivity of the hardened material of the resin composition contained in the first resin layer 14. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013000995(A) 申请公布日期 2013.01.07
申请号 JP20110134899 申请日期 2011.06.17
申请人 PANASONIC CORP 发明人 INOUE HIROHARU;KISHINO MITSUTOSHI
分类号 B32B15/08;H05K1/03 主分类号 B32B15/08
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