| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology capable of processing locally an end face of a substrate, while suppressing scattering of processing liquid onto a main surface of the substrate. <P>SOLUTION: This substrate processing apparatus 100 etches a side end face 91S of a glass substrate (substrate 90) which is one kind of a hard and brittle substrate. The substrate processing apparatus 100 includes a sponge body 213 (abutting member) whose outer peripheral surface forms an abutting surface abutting on the side end face 91 of the substrate 90, a sponge body rotating driving part 240 (rotating driving part) for rotating the sponge body 213, and a processing liquid supply tube 251 (processing liquid supply part) for supplying the processing liquid to the sponge body 213. The side end face 91S of the substrate 90 is etched by pressing the outer peripheral surface of the sponge body 213 rotating about the z-axis onto the side end face 91S of the substrate 90 conveyed in the +y-direction by a conveyance roller 31. <P>COPYRIGHT: (C)2013,JPO&INPIT |
