| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in substrate in which arrangement density of internal components can be further improved. <P>SOLUTION: A component built-in substrate includes: a tabular insulation layer having a first surface and a second surface facing the first surface; a component having a rod-like shape and a structure in which at least both end surfaces of the rod-like shape are respectively electrode surfaces, and arranged inside the tabular insulation layer in the thickness direction so that one end surface of both end surfaces faces the first surface and the other end surface of both end surfaces faces the second surface; a first wiring pattern provided on the first surface of the tabular insulation layer; a first connection member electrically connecting the first wiring pattern and the electrode surface on one end surface side of the component; a second wiring pattern provided on the second surface of the tabular insulation layer; and a second connection member electrically connecting the second wiring pattern and the electrode surface of the other end surface side of the component by penetrating a part of the tabular insulation layer in the thickness direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
