| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wireless communication recording medium capable of connecting a semiconductor element and an antenna with high reliability and at a low cost and effectively radiating heat of the semiconductor element during wireless communication, and a manufacturing method for the wireless communication recording medium. <P>SOLUTION: An inlet 1 comprises: an insulating film substrate 2; a loop-shaped antenna 3 arranged on the insulating film substrate 2; a first heat radiation land 4 and a second heat radiation land 5 formed by metal foil; and a semiconductor element 6 including a plurality of electrodes on a bottom surface section arranged to be brought into contact with the first heat radiation land 4 and the second heat radiation land 5. The first heat radiation land 4 includes two electrode lands 4a and 4b which are connected to the electrodes of the bottom surface section of the semiconductor element 6 and are connected to ends 3a and 3b of the loop of the antenna 3. The second heat radiation land 5 is separated from the first heat radiation land 4. Each of the first heat radiation land 4 and the second heat radiation land 5 has many through holes opened in each film thickness direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
