| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate downsizing of elements such as a photoreflector by eliminating a void generated when a light-blocking groove is reduced in size. <P>SOLUTION: A method for manufacturing an optical semiconductor element includes: die-bonding and wire-bonding a plurality of groups of light-emitting elements 2 and light-receiving elements 3 on an aggregate substrate 10 to seal them with an optically clear resin 4, and then forming narrow light-blocking grooves 12 by dicing between the light-emitting elements and light-receiving elements in the optically clear resin 4; entirely dropping a light-blocking resin 13 having low viscosity (e.g., 100 mPa s or less) over the optically clear resin 4 including the light-blocking grooves 12, and then rapidly rotating the substrate by a spinner to allow the light-blocking resin 13 to be attached to a wall surface or the like of the light-blocking grooves 12 in a state in which the light-blocking resin 13 is separated in a center portion of the groove; and then subjecting the light-blocking resin 13 to ultraviolet curing (or thermosetting), and dicing the aggregate substrate 10 from a rear side thereof to produce a photoreflector. <P>COPYRIGHT: (C)2013,JPO&INPIT |
