| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface treatment liquid used in electronic industry fields such as printed circuit board production and general industrial fields such as coating work for firmly adhering the surface of copper and/or copper alloy to resin or the like while maintaining the glossiness of the surface of the copper and/or copper alloy. <P>SOLUTION: The copper and/or copper alloy surface treatment liquid includes (1) hydrogen peroxide, (2) phosphoric acid or a mixture of phosphoric acid and sulfuric acid, (3) benzotriazoles, (4) amino-tetrazole, and (5) chloride ions. <P>COPYRIGHT: (C)2013,JPO&INPIT |
