发明名称 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device which in an embodiment can achieve light distribution control at low cost and can be applied for a wide range of uses, and a manufacturing method therefor. <P>SOLUTION: There is provided a manufacturing method for a semiconductor light-emitting device which includes a first frame having a light-emitting element fastened thereto, a second frame disposed apart from the first frame and connected to the electrode of the light-emitting element with a metal wire, and a resin package covering the light-emitting element and the first and the second frames. The manufacturing method comprises the steps of: forming a first resin which covers the light-emitting element and the first and the second frames on the surface of a metal plate having a plurality of the first frames and a plurality of the second frames alternately arranged thereon; forming a groove along the outer periphery of the resin package including the first resin on top of the metal plate; filling the inside of the groove with a second resin; and dividing the second resin along the groove into sections to form the resin package covering the outer periphery of the first resin with the second resin. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013004807(A) 申请公布日期 2013.01.07
申请号 JP20110135585 申请日期 2011.06.17
申请人 TOSHIBA CORP 发明人 SHIMOMURA KENJI;KOMATSU TETSUO
分类号 H01L33/54;H01L21/56;H01L23/28;H01L23/48;H01L33/62 主分类号 H01L33/54
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