发明名称 SUBSTRATE MOUNTING COMPONENT AND SUBSTRATE MOUNTING COMPONENT MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate mounting component which enables the accuracy of coplanarity to be easily improved and also enables characteristics inspection to be conducted before mounting, and to provide a manufacturing method which improves the manufacturability of the substrate mounting component. <P>SOLUTION: An optical connector 2 serving as a substrate mounting component is surface-mounted on a circuit board 1 with multiple conductive lead frames 21, which serve as wires, led out. The multiple lead frames 21 are fixed all at once by an insulative flatness securing part 23. The flatness securing part 23 is formed so as to extend in the arrangement direction of the multiple lead frames 21. The flatness securing part 23 may be provided so as to be fastened to the multiple lead frames 21 or may be detachably provided. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013004437(A) 申请公布日期 2013.01.07
申请号 JP20110136936 申请日期 2011.06.21
申请人 YAZAKI CORP 发明人 IKETANI KENICHI;HIKOSAKA TOMOHIRO
分类号 H01R12/71;G02B6/42;H01L23/48;H01L31/02;H01R13/46 主分类号 H01R12/71
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