| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, which shows a high dehydration ring closure rate even when the composition is subjected to a heating process at 250°C or lower, and which gives a patterned cured film having excellent chemical resistance and adhesiveness to a substrate under high temperature and high humidity conditions, to provide a production method of a patterned cured film using the photosensitive resin composition, and to provide an electronic component having high reliability by having an interlayer insulating film and a surface protective film using the patterned cured film. <P>SOLUTION: The photosensitive resin composition includes (a) an alkali-soluble resin, (b) a photosensitive agent, (c) a solvent, (d) a crosslinking agent, and (e) a compound having a phosphate group, phosphonate group or phosphinate group in the molecule and having at least one hydroxy group on a phosphorus atom of these groups. <P>COPYRIGHT: (C)2013,JPO&INPIT |
