发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To minimize overall electrical impact on the depth of a side electrode by selecting the relative relationship of a restriction layer material and an element layer material and the electronic characteristics. <P>SOLUTION: In the electronic component and the manufacturing method therefor, a restriction layer having second electronic characteristics is formed, at first, on an element layer having first electronic characteristics. The characteristics of the electronic component are affected principally by the first electronic characteristics. Subsequently, both the restriction layer and element layer are sintered at the sintering temperature. The characteristics of the electronic component are stabilized by selecting the relationship of the first electronic characteristics and the second electronic characteristics. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013004985(A) 申请公布日期 2013.01.07
申请号 JP20120137205 申请日期 2012.06.18
申请人 NATIONAL CHENG KUNG UNIV 发明人 LEE MUN HEE
分类号 H01G4/12;H01F17/04;H01F27/29;H01G4/30;H05K1/16;H05K3/46 主分类号 H01G4/12
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