| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which can suppress power consumption. <P>SOLUTION: A semiconductor manufacturing apparatus 1 comprises: a processing container 2 having a top face 2a, which is a processing container 2 that defines a processing space S; a loading table 3 provided in the processing space S; an upper electrode 20 provided above the loading table 3 so as to face the loading table 3; heaters 35, 36 which heat the upper electrode 20, the heaters 35, 36 being provided around the upper electrode 20 and below the top face 2a; and a heat insulation member 50 mounted on the top face 2a. The heat insulation member 50 includes a plate-like part 51 and a heat insulation part 52 provided on one principal surface 51a side of the plate-like part 51. <P>COPYRIGHT: (C)2013,JPO&INPIT |
