| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide electronic equipment having improved productivity. <P>SOLUTION: The endoscope device includes: a circuit board having a mounting surface; an electronic component having a bottom surface facing the mounting surface of the circuit board and a side edge; a first electrode mounted across a corner portion of the bottom surface of the electronic component and the side edge; a second electrode adjacent to the first electrode and mounted across the bottom surface of the electronic component and the side edge; a third electrode mounted on the mounting surface of the circuit board to face the first electrode, including an edge portion following the side edge of the electronic component and located outside of a first area of the mounting surface covered by the electronic component, and having a wider area than that of the first electrode and soldered to the first electrode; and a fourth electrode mounted on the mounting surface of the circuit board to face the second electrode, including an edge portion following the side edge of the electronic component and located outside of the first area of the mounting surface, and soldered to the second electrode. <P>COPYRIGHT: (C)2013,JPO&INPIT |
