| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a semiconductor light-emitting device package that prevents an occurrence of breakage, such as cracks, and has high strength and high heat dissipation; and a semiconductor light-emitting device using the semiconductor light-emitting device package. <P>SOLUTION: A resin molded body 2 has on a first surface thereof a concave part 8 for mounting a semiconductor light-emitting element 5. The resin molded body contains polyorganosiloxane, and a content of bifunctional silicon of the resin molded body is equal to or greater than 5% by weight and equal to or less than 12% by weight. A first lead frame 3a includes: a first exposed lead part 11a exposed to a bottom surface of the concave part; a first outer lead part 12a located outside the resin molded body; a first connection lead part 13a to connect one end of the first exposed lead part and the first outer lead part; and a first extended lead part 14a which extends from the other end of the first exposed lead part toward a second surface opposed to the first surface, and is exposed from the second surface. A second lead frame 3b includes a second exposed lead part 11b, a second outer lead part 12b and a second connection lead part 13b. <P>COPYRIGHT: (C)2013,JPO&INPIT |
