发明名称 MULTILAYER CAPACITOR AND MANUFACTURING METHOD OF MULTILAYER CAPACITOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer capacitor and a manufacturing method of the multilayer capacitor which can prevent the generation of cracks due to stress in baked layers and can also prevent insulation failure caused by the infiltration of plating liquid. <P>SOLUTION: In a multilayer capacitor 1, baked layers 17A and 17B are formed so as to entirely cover lead-out conductors 12A and 12B led out from internal electrodes 6A and 6B to an end face of a laminate 2. Consequently, the infiltration of plating liquid into the internal electrodes 6A and 6B side is prevented when forming plating layers 18A and 18B, thereby preventing the occurrence of insulation failure. In addition, the area of the baked layers 17A and 17B can be reduced because the baked layers 17A and 17B partially cover dummy electrodes 13C, 13F, 13G, and 13H. Thus, excessive stress in the baked layers 17A and 17B can be suppressed, thereby preventing the generation of cracks due to the stress in the baked layers 17A and 17B. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013004569(A) 申请公布日期 2013.01.07
申请号 JP20110131163 申请日期 2011.06.13
申请人 TDK CORP 发明人 TOGASHI MASAAKI
分类号 H01G4/30;H01G4/12;H01G4/232 主分类号 H01G4/30
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