| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a discharge device, capable of reducing the time required to raise the temperature of a thin film material while securing satisfactory uniformity of film thickness, and to provide a thin film-forming apparatus. <P>SOLUTION: The discharge device includes: a container body 13 formed from a heat conductive material; a plurality of receiving holes formed in the container body 13; an evaporation container 6 disposed within each receiving hole, the evaporation container containing a thin film material 4; and a heating device 7 for heating the evaporation container 6. The heating device 7 is located between the outer circumferential surface of the evaporation container 6 and the inner circumferential surface of the receiving hole and is disposed to surround the outer circumferential surface of the evaporation container 6. When the heating device 7 heats the evaporation container 6 with the thin film material 4 being stored in the evaporation container 6, vapor is generated from the thin film material 4 stored in each evaporation container 6 and released through an opening of each evaporation container 6. Since a plurality of evaporation containers 6 are independently heated, the thin film material 4 can be rapidly heated. The temperature difference among the plurality of evaporation containers 6 is minimized due to the heat conduction of the container body 13, and the amount of the vapor being released is uniformed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
