| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which suppresses the deformation of a pipe during resin molding, and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device includes: a semiconductor module 2; a cooler 3 having an upper surface to which the semiconductor module 2 is joined and side surfaces 20, 22 to which pipes 14, 15 for coolant circulation are respectively fixed; and a resin mold layer 4 covering the semiconductor module 2 and an outer periphery of the cooler 3. Protruding parts 25, 26, protruding from the side surfaces 20, 22 and enclosing the pipes 14, 15, are provided at the side surfaces 20, 22 of the cooler 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
