| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an interposer including a stress relaxation mechanism for connecting a semiconductor chip with a mounting substrate achieving high reliability. <P>SOLUTION: An interposer includes: a lower side wiring substrate part 6; an upper side wiring substrate part 7 disposed above the lower side wiring substrate part 6; and a through electrode TE provided so as to penetrate through the upper side wiring substrate part 7 and get into the lower side wiring substrate part 6 and connecting the upper side wiring substrate part 7 with the lower side wiring substrate part 6. The lower side wiring substrate part 6 is separated from the upper side wiring substrate part 7, and a side surface of the through electrode TE is exposed in a space formed between the lower side wiring substrate part 6 and the upper side wiring substrate part 7. <P>COPYRIGHT: (C)2013,JPO&INPIT |
