发明名称 SEMIAROMATIC MOLDING MATERIAL AND USE THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a molding material, which can be used to manufacture a component used in automobile field and electric/electronic engineering fields, and is characterized in particular by heat aging stability (heat aging resistance) at temperatures of at least 180&deg;C, especially at temperatures over 200&deg;C, and high thermal stability especially over 220&deg;C (HDT A) and especially preferably over 240&deg;C (HDT A). <P>SOLUTION: The polyamide molding material does not include metal salts and/or metal oxides of a transition metal of the groups VB, VIB, VIIB or VIIIB of the periodic table. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013001906(A) 申请公布日期 2013.01.07
申请号 JP20120132556 申请日期 2012.06.12
申请人 EMS-PATENT AG 发明人 BAYER ANDREAS;LAMBERTS NIKOLAI;HOFFMANN BOTHO;HEWEL MANFRED
分类号 C08L77/06;C08K3/00;C08K7/02;C08L77/02 主分类号 C08L77/06
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