发明名称 MANUFACTURING METHOD OF MEMS DEVICE, MEMS DEVICE, AND ULTRASONIC TRANSDUCER
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a MEMS device with a functional film having a uniform thickness dimension, a MEMS device, and an ultrasonic transducer. <P>SOLUTION: A manufacturing method of a MEMS device comprises: a salient formation step of forming a salient having a flat apical surface and a side surface on a first surface 11A of a substrate 11; a film formation step of forming a support film 12 having a side wall part 121 and a membrane 122 on the first surface 11A; a mask step of forming a mask layer having a hole part 31 in a position where the hole part overlaps a protruding apical surface; and an etching step of forming a cavity C by performing etching from the hole part to the membrane 122 of the support film 12 along a thickness direction and then performing side etching to the side wall part 121 along a surface of the membrane 122. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013005250(A) 申请公布日期 2013.01.07
申请号 JP20110134863 申请日期 2011.06.17
申请人 SEIKO EPSON CORP 发明人 SUZUKI HIRONORI;TSURUNO JIRO;MATSUDA YOJI
分类号 H04R17/00;B81B3/00;B81C1/00;H01L41/09;H01L41/22 主分类号 H04R17/00
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