| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material suppressed in generation of bubbles around conductive particles after an FPC has been subjected to thermal pressure bonding, thereby having a larger adhesive force. <P>SOLUTION: An anisotropic conductive material contains a conductive particle, a binder resin and a solvent. The conductive particle has a 10% K value of a compressive elastic modulus at 140°C, which is 20-60% of a 10% K value of a compressive elastic modulus at 25°C, while the 10% K value of a compressive elastic modulus at 25°C is 2,300-4,500 N/mm<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
