| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that prevents fracture of an insulated substrate, and improves heat dissipation than conventional ones. <P>SOLUTION: A semiconductor device 110 is configured so that an insulated substrate 2 having heat-generating semiconductor elements 5 and 6 mounted thereon is connected to a major surface 100a of a screw-fixed type square-like metallic base plate 100. The metallic base plate includes: screw fixing through holes 101a and 101b which are respectively adjacent to two opposite sides 100b and 100c, and extend through the metallic base plate; and a concave-like groove 102 between the screw fixing through hole 101a and the insulated substrate. The groove extends linearly along the side 2b of the insulated substrate which extends along the two opposite sides of the metallic base plate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
