发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity and excellent flexibility, plating property and heat resistance, and to provide a photosensitive film using the composition. <P>SOLUTION: The photosensitive resin composition comprises (A) a polymerizable prepolymer having a carboxyl group and an ethylenically unsaturated group, (B) a photopolymerization initiator generating a free radical by active rays, (C) a black pigment or a dispersion of a black pigment, (D) a thermoplastic polymer having a carboxyl group, (E) an urethane unsaturated organooligomer, and (F) a photopolymerizable compound. For the photopolymerization initiator as the component (B) generating a free radical by active rays, a combination of two or more in the following compounds is used: (B)-(1) 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; (B)-(2) 2,2-dimethoxy-1,2-diphenylethan-1-one; and (B)-(3) ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-,1-(0-acetyloxime). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013003509(A) 申请公布日期 2013.01.07
申请号 JP20110137266 申请日期 2011.06.21
申请人 HITACHI CHEM CO LTD 发明人 OZAWA KYOKO
分类号 G03F7/031;C07C49/84;C08F2/48;G03F7/004;G03F7/027;G03F7/038;H05K3/28 主分类号 G03F7/031
代理机构 代理人
主权项
地址