CROSSLINKED POLYIMIDE RESIN, ADHESIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF, COVER LAY FILM AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a polyimide resin with which an adhesive layer is formed free from generating a volatile component comprising cyclic siloxane compound, having excellent soldering heat resistance and prevented from the deterioration in adhesion force between a wiring layer and a cover lay film even in a use condition where the adhesive layer is repeatedly exposed to a high temperature.

SOLUTION: The crosslinked polyimide resin is obtained by reacting (A) polyimide resin having ketone group with (B) an amino compound having at least two primary amino groups as functional groups. The (A) component is the polyimide resin obtained by reacting acid anhydride component containing aromatic tetracarboxylic anhydride with a diamine component containing aliphatic diamine. The ketone group in the polyimide resin originates from the acid anhydride component and/or the diamine component. The polyimide resin is crosslinked by the amino compound by reacting the amino group of the (B) component with the ketone group in the polyimide resin to form C=N bond.

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