LAMINATED SHEET FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE LAYER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a laminated sheet for semiconductor, capable of easily forming a semiconductor chip with adhesive layer which includes an adhesive layer having a shape suitable for mounting of a semiconductor chip.

SOLUTION: The laminated sheet 100 for semiconductor includes: a pressure-sensitive adhesive film 120 and an adhesive film 110 adhered to the pressure-sensitive adhesive film 120. The adhesive film 110 contains a thermoplastic resin having an imido framework, a photo-curable resin and a photo-radical generator, and the pressure-sensitive adhesive film 120 contains an acrylic copolymer and a photo-radical generator. The glass transition temperature of the thermoplastic resin is 10°C or higher, and the glass transition temperature of the acrylic copolymer is 0°C or lower.

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