| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inorganic polysilazane, small in the shrinkage in a firing step in an oxidant such as steam and hardly generating the crack of a silica film or peeling from a semiconductor substrate, and to provide a silica film-forming coating liquid containing inorganic polysilazane. <P>SOLUTION: The silica film forming coating liquid contains the inorganic polysilazane, wherein in an<SP POS="POST">1</SP>H-NMR spectrum, when the peak area in the range of ≥4.75 and <5.4 ppm is expressed by A, the peak area in the range of ≥4.5 and <4.75 ppm is expressed by B and the peak area in the range of ≥4.2 and <4.5 ppm is expressed by C, the value of A/(B+C) is 0.9-1.5, the value of (A+B)/C is 4.2-50 and the mass average molecular weight expressed by polystyrene equivalent is 2,000-20,000. <P>COPYRIGHT: (C)2013,JPO&INPIT |
