| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for bonding of a semiconductor which has a low elastic modulus and good adhesion, and a semiconductor device using the thermosetting resin composition. <P>SOLUTION: The thermosetting resin composition for bonding of a semiconductor comprises, as essential constituents, (A) a carbon hydride compound having a number-average molecular weight of 500 to 30000 inclusive, and at least one double bond per molecule, or a derivative thereof, (B) a monomer having one or more ethylenic unsaturated groups, (C) a radical polymerization catalyst, (D) a (meth)acrylic acid ester derivative having a cyclic disulfide group expressed by the general formula [I], and (E) filler. In the semiconductor device, the thermosetting resin composition is used. <P>COPYRIGHT: (C)2013,JPO&INPIT |
