| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reflow device in which nonuniformity of temperature distribution can be reduced without increasing the tact time, by additionally providing a structure of reducing the nonuniformity of temperature distribution on the surface of a substrate by performing local heating and cooling. <P>SOLUTION: The reflow device having a plurality of heating zones where a printed-wiring board is heated while being conveyed comprises a conveyor which conveys the printed-wiring board, a plurality of local heating units provided, respectively, for the heating zones in order to heat a part of the printed-wiring board locally, and a heated object passage detection sensor which detects passage of the printed-wiring board. The local heating units can be driven individually so that contact and noncontact with the printed-wiring board can be controlled, and the temperature of the local heating units can be controlled individually. <P>COPYRIGHT: (C)2013,JPO&INPIT |
