| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board having a solder resist layer which has an opening shape in which an excellent solder bump can be formed, and to provide a manufacturing method therefor. <P>SOLUTION: The printed wiring board has: an interlayer insulating layer; a conductive pattern formed on the interlayer insulating layer; a solder resist layer that is provided on the interlayer insulating layer and the conductive pattern, and has an opening part from which at least one part of the conductive pattern is exposed; and a solder bump which is formed in the inner part of the opening part. The shape of the opening part is a teardrop shape in plan view or an n-angled shape (n≥3) in plan view. <P>COPYRIGHT: (C)2013,JPO&INPIT |
