| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the number of terminals for connecting chips in a SiP (System in Package). <P>SOLUTION: A semiconductor integrated circuit includes a first semiconductor chip and a second semiconductor chip which are integrated in a package. The first semiconductor chip includes a first communication part and a plurality of analog circuits. The second semiconductor chip includes a second communication part and a memory part storing characteristic adjustment data for the plurality of analog circuits. The first communication part and the second communication part are connected by a serial data communication line. The characteristic adjustment data for the plurality of analog circuits included in the first semiconductor chip is transferred to the plurality of analog circuits, respectively, via the serial data line. <P>COPYRIGHT: (C)2013,JPO&INPIT |
