METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, FILM GLUE, AND ADHESIVE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of sufficiently reducing voids at a bump portion and improving productivity in manufacturing a semiconductor device by a flip chip mounting.

SOLUTION: The method of manufacturing a semiconductor device includes: a step for pasting a film glue whose slip viscosity at lamination temperature is 6000 Pa*s or less to a functional surface of a semiconductor wafer having the functional surface on which a solder bump is formed, by vacuum lamination, to provide a semiconductor wafer with an adhesive layer; a step for reducing the thickness of the semiconductor wafer by grinding a surface that is on the side opposite to the functional surface of the semiconductor wafer with an adhesive layer; a step for cutting the semiconductor wafer whose thickness has been reduced, along with the adhesive layer into a plurality of semiconductor elements, to provide a semiconductor element with an adhesive layer; and a step for press-fitting the semiconductor element with an adhesive layer and another semiconductor element or a support member for mounting the semiconductor element together with the adhesive layer of the semiconductor element with an adhesive layer in between.

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