| 摘要 |
<P>PROBLEM TO BE SOLVED: To cool a thyristor chip in a use environment where a water cooling facility is not prepared. <P>SOLUTION: In a crimp type high power thyristor module 100 equipped with thyristor chips 113 and 123, a base portion 1a of a heat sink 1 containing a plurality of heat radiation fins 1b is crimped in vertical direction with an insulating plate 11, a common bar 12, an anode sub-spacer 181, a thyristor chip 113, a cathode sub-spacer 183, a cathode spacer 14, and a cathode terminal bar 18 by crimp means 19. The base portion 1a of the heat sink 1 is crimped in vertical direction with an insulating plate 21, the common bar 12, a cathode spacer 24, a cathode sub-spacer 193, a thyristor chip 123, an anode sub-spacer 191, and an anode terminal bar 22 by crimp means 29. <P>COPYRIGHT: (C)2013,JPO&INPIT |
