| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the ball loading efficiency while suppressing the manufacturing cost. <P>SOLUTION: The ball loading apparatus includes: a suction head 2 that holds solder balls 300; a support section 3 that supports the suction head 2; and a drive mechanism 4 that drives the support section 3 closer to/away from a board 400 placed on a loading part 11 in a vertical direction. The ball loading apparatus is configured to execute the loading process to load the solder balls 300 on the board 400. The ball loading apparatus includes a speed reduction mechanism 5 that reduces the movement speed of the suction head 2 as the suction head 2 gets closer to the board 400 while executing the loading process. The speed reduction mechanism 5 includes: a contact section 51 which is connected to the support section 3 so as to move in the vertical direction to come into contact with the loading part 11 while executing the loading process; and a drag force generating section 52 that includes a spring 61 for generating a drag force which acts on the support section 3 in the same direction as a relative movement direction of the contact section 51 with respect to the support section 3, and a damper 62. <P>COPYRIGHT: (C)2013,JPO&INPIT |
