发明名称 METHOD AND DEVICE FOR EVALUATING THERMAL CONDUCTIVITY OF THERMALLY CONDUCTIVE COMPOSITION, COMPUTER-READABLE RECORDING MEDIUM, AND PROGRAM CAUSING COMPUTER TO EXECUTE THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To evaluate thermal conductivity taking account of a connection state of components of a thermally conductive composition. <P>SOLUTION: A thermal conductivity evaluation device 30 of a thermally conductive composition includes: first means 31 for analyzing distribution information relating to thermal conduction of the thermally conductive composition by a two-dimensional DFA method to obtain an inclination of the two-dimensional DFA; and second means 32 for evaluating a fractal property of the thermally conductive composition by the inclination of the two-dimensional DFA that has been obtained by the first means 31 and evaluating the thermal conductivity of the thermally conductive composition on the basis of the evaluation result. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013003069(A) 申请公布日期 2013.01.07
申请号 JP20110136964 申请日期 2011.06.21
申请人 MITSUBISHI CHEMICALS CORP 发明人 NOUMOTO ATSUSHI
分类号 G01N25/18;C09K5/08 主分类号 G01N25/18
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