| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer mapping device which can quickly and surely detect whether a semiconductor substrate protrudes from a container vessel. <P>SOLUTION: In the wafer mapping device in an embodiment, an illumination optical system irradiates a linear slit light intersecting a wafer side face at right angles on plural spots of each wafer. First and second image pickup units photograph the wafer side face having the linear slit light irradiated thereon as first and second shot images. When the first and the second shot images are photographed, a containment state detection unit calculates the amount of protrusion of the wafer from the container vessel by a trigonometrical survey method. When only one of the first and the second shot images is photographed, the containment state detection unit compares an image formed position at which a reflected light of the linear slip light forms an image on an image plane with a reference position to determine whether the wafer protrudes from the container vessel. <P>COPYRIGHT: (C)2013,JPO&INPIT |
