| 摘要 |
[Problem] To prevent the overheating of a high-capacity module due to a curving power circuit board in association with the thermal expansion of power circuit constituent materials, which is caused by heat generation from a high-heat-generating element, while achieving size reduction, weight reduction, surge reduction and reduction in transmission loss for the high-capacity module. [Solution] A drive circuit is placed over a high-heat-generating element arranged on a power circuit, and the average coefficient of thermal expansion for a drive circuit board on the side of the power circuit is set so as to become larger than the average coefficient of thermal expansion for the drive circuit board on the side opposite the power circuit such that when the power circuit board is curved due to the heat generation from the high-heat-generating element in association with the operation of the module, the drive circuit board is curved in the same direction as the power circuit board. Hereby, improper connection between the high-heat-generating element in the power circuit and the drive circuit board is minimized and the heat generated by the high-heat-generating element is more efficiently dissipated while achieving size reduction, weight reduction, surge reduction and reduction in transmission loss for the high-capacity module. |
