发明名称 |
MOLDING APPARATUS, METHOD OF FORMING MOLDED PRODUCT, AND MOLDED PRODUCT |
摘要 |
A molding apparatus includes a cavity mold, a core mold, a core pin, and a cavity pin. After molten resin has been filled in a cavity, at least one of the core pin and the cavity pin is moved to be pressed onto the molten resin so that a part of the molten resin is compressed before the molten resin is cured, and a molded hole is formed by cutting off the compressed part of the molten resin by moving the core pin and the cavity pin.
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申请公布号 |
US2013004708(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213530542 |
申请日期 |
2012.06.22 |
申请人 |
SONY CORPORATION;KAYAMA SHUN;SHIMIZU YUKIKO;HANYU ATSUHIDE;HOSHINO SUSUMU;KAWAMURA KEISUKE |
发明人 |
KAYAMA SHUN;SHIMIZU YUKIKO;HANYU ATSUHIDE;HOSHINO SUSUMU;KAWAMURA KEISUKE |
分类号 |
B29C45/26;B29C45/00;B29C45/03;B29C45/72;B32B3/24 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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