发明名称 MOLDING APPARATUS, METHOD OF FORMING MOLDED PRODUCT, AND MOLDED PRODUCT
摘要 A molding apparatus includes a cavity mold, a core mold, a core pin, and a cavity pin. After molten resin has been filled in a cavity, at least one of the core pin and the cavity pin is moved to be pressed onto the molten resin so that a part of the molten resin is compressed before the molten resin is cured, and a molded hole is formed by cutting off the compressed part of the molten resin by moving the core pin and the cavity pin.
申请公布号 US2013004708(A1) 申请公布日期 2013.01.03
申请号 US201213530542 申请日期 2012.06.22
申请人 SONY CORPORATION;KAYAMA SHUN;SHIMIZU YUKIKO;HANYU ATSUHIDE;HOSHINO SUSUMU;KAWAMURA KEISUKE 发明人 KAYAMA SHUN;SHIMIZU YUKIKO;HANYU ATSUHIDE;HOSHINO SUSUMU;KAWAMURA KEISUKE
分类号 B29C45/26;B29C45/00;B29C45/03;B29C45/72;B32B3/24 主分类号 B29C45/26
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