发明名称 METHOD FOR BONDING FILM BASE MATERIALS
摘要 <p>Provided is a method for bonding together films made of different types of materials to produce a packaging article given a bag shape, wherein firm bonding is possible without the use of a laminate resin, there is no seepage of foreign matter, residual solvent, or the like, and the weather resistance is also excellent. A method for bonding together films made of different types of materials to produce a packaging article given a bag shape, wherein the method comprises preparing a pair of film base materials made of different types of materials, irradiating with an electron beam a portion of at least one film base material where bonding is to take place, and bonding only the portion that has been irradiated with the electron beam, to the other film base material, to make a bag shape.</p>
申请公布号 WO2013001606(A1) 申请公布日期 2013.01.03
申请号 WO2011JP64817 申请日期 2011.06.28
申请人 DAI NIPPON PRINTING CO., LTD.;UEKI TAKAYUKI;YAGI IZUMI;SHIINA NORIYUKI 发明人 UEKI TAKAYUKI;YAGI IZUMI;SHIINA NORIYUKI
分类号 C08J5/12;B29C65/00;B65D65/40;C08J7/00 主分类号 C08J5/12
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