SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

Disclosed herein is a semiconductor package including: first power device; second power device formed in an upper portion of the first power device; a first lead frame formed in a lower portion of the first power device; a second lead frame formed in the upper portion of the first power device and a lower portion of the second power device; a third lead frame formed in an upper portion of the second power device; a fourth lead frame electrically connected to at least one of the power device and the second power device; and a sealing substance exposing a part of the first through fourth lead frames and sealing the other parts thereof.