发明名称 TRANSMISSION LINE STRUCTURE WITH LOW CROSSTALK
摘要 A transmission line structure is disclosed. The structure includes at least one signal transmission line and a pair of ground transmission lines embedded in a first level of a dielectric layer on a substrate, wherein the pair of ground transmission lines are on both sides of the signal transmission line. A first ground layer is embedded in a second level lower than the first level of the dielectric layer and a second ground layer is embedded in a third level higher than the first level of the dielectric layer. First and second pairs of via connectors are embedded in the dielectric layer, wherein the first pair of via connectors electrically connects the pair of ground transmission lines to the first ground layer and the second pair of via connectors electrically connects the pair of ground transmission lines to the second ground layer.
申请公布号 US2013002375(A1) 申请公布日期 2013.01.03
申请号 US201113175253 申请日期 2011.07.01
申请人 MEDIATEK INC.;YANG MING-TZONG;LEE TUNG-HSING;CHAN KUEI-TI 发明人 YANG MING-TZONG;LEE TUNG-HSING;CHAN KUEI-TI
分类号 H01P3/08 主分类号 H01P3/08
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